TLP 300 DTX - Guarded Hot Plate


Thermal Conductivity Measuring Instrument with Guarded Hot Plate

ISO 8302, ASTM C177, DIN 52612, DIN EN 1946-2, EN 12664, EN 12667, EN 12939

Thermal conductivity measuring instrument TLP 300 DTX-1 /-2 after the procedure with guarded hot plate to determine the thermal conductivity and heat transmission resistance of building, insulation and other materials. The device is equipped with an insulated test chamber to avoid external thermal influences, air-cooled Peltier-temperature, electrical lifting device and digital pressure and sample thickness-measurement. The device is available as a one- or two-plate device.

Specification

Measuring range 0.01 – 1.0 W/m·K
Sample size (W x D) 100 x 100 - 300 x 300 mm
Sample thickness
2 samples 10 - 40 mm 1 sample 20 - 80 mm
Sample middle temperature 0°C - 60°C
Dimensions (W x D x H) 537 x 560 x 617 mm
Weight 68 kg