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TLP 300

Thermal conductivity measuring device with guarded hot plate according to ISO 8302, ASTM C177, EN 1946-2, EN 12664, EN 12667 und EN 12939

TLP 300

Measuring devices of the TLP 300 series are compact, robust desktop devices equipped with an integrated Single Board Computer (SBC) with Windows 10 operating system, the software Lambda 2016 and a high resolution color touch display that can be operated in standalone mode.

Numerous interfaces such as RS232, USB and Gigabit Ethernet enable the connectivity to peripheral devices and the fast and convenient transfer of all relevant data. The direct connection to a printer allows for printing test reports without using an additional PC.

Features:

  • Fully insulated test chamber to avoid external influences
  • One-plate method for measuring one sample
  • External cooling with tap water or recirculation cooler for three different temperature ranges
  • Electrically operated plate lifting mechanism
  • Digital measurement of pressure and sample thickness
  • SBC with 32 GB SSD, Windows 10 and software Lambda 2016
  • 10.1“ color touch-screen
  • Interfaces: 1x RS232, 2x USB, 1x Gigabit Ethernet

Technical data:

TLP 300 basic TLP 300 extended TLP 300 high temperature
Measuring range* 0,002 – 0,5 W/m·K 0,002 – 0,5 W/m·K 0,002 – 0,5 W/m·K
Sample size (LxW) 100 x 100 –
300 x 300 mm
100 x 100 –
300 x 300 mm
100 x 100 –
300 x 300 mm
Sample thickness (H) 5 – 60 mm 5 – 60 mm 5 – 60 mm
Temperature range
Cooling plate
Heating plate
(min./max.)
-20 / +60 °C
-10 / +70 °C
(min./max.)
-20 / +110 °C
-10 / +120 °C
(min./max.)
0 / +170 °C
10 / +180 °C
Dimensions (HxWxD) 620 x 440 x 400 mm 620 x 440 x 400 mm 620 x 440 x 400 mm
Power supply 110 – 230 V
50 / 60 Hz
110 – 230 V
50 / 60 Hz
110 – 230 V
50 / 60 Hz
Weight 45 kg 45 kg 45 kg

* depending on sample thickness