• Deutsch
  • English

TLP 500 HTX

Thermal conductivity measuring device with guarded hot plate according to 8302, ASTM C177, EN 1946-2, EN 12664, EN 12667, EN 12939 and DIN CEN/TS 15548-1

TLP 500 HT

Measuring devices of the TLP 500 HTX series are robust cabinet devices, that are especially designed for high temperature tests. Due to the integrated Single Board Computer (SBC) with Windows 10 operating system, the software Lambda 2016 and the high resolution color touch display the devices are very user friendly.

Numerous interfaces such as RS232, USB and Gigabit Ethernet enable the connectivity to peripheral devices and the fast and convenient transfer of all relevant data. The connection to an external PC allows for performing extensive evaluations of the test results and printing of test reports.

Features:

  • Temperature controlled test chamber to avoid external influences
  • Two device versions according to one (X1) or two plate (X2) method
  • Cooling with external recirculation cooler for wide temperature and measuring range
  • Electrically operated plate lifting mechanism
  • Electrically operated cover lifting mechanism
  • Digital measurement of pressure and sample thickness
  • SBC with 32 GB SSD, Windows 10 and software Lambda 2016
  • 10.1“ color touch screen
  • Interfaces: 1x RS232, 2x USB, 1x Gigabit Ethernet

Technical data:

TLP 500 HTX1 TLP 500 HTX2
Measuring range* 0,005 – 1,0 W/m·K 0,005 – 1,0 W/m·K
Sample size (LxW) 300 x 300 – 500 x 500 mm 300 x 300 – 500 x 500 mm
Sample thickness (H) 10 – 100 mm 2x 10 – 50 mm
Temperature range
Cooling plate
Heating plate
(min./max.)
+30 – +330 °C
+30 – +400 °C
(min./max.)
+30 – +330 °C
+30 – +400 °C
Dimensions (HxWxD)
(Haube geöffnet)
227 x 102 x 104 cm 227 x 102 x 104 cm
Power supply 110 – 230 V 50/60 Hz 110 – 230 V 50/60 Hz
Weight 328 kg 326 kg

* depending on sample thickness