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TLP 500

Thermal conductivity measuring device with guarded hot plate according to ISO 8302, ASTM C177, EN 1946-2, EN 12664, EN 12667 and EN 12939

Measuring devices of the TLP 500 series are robust cabinet devices, which are especially suited for testing thicker samples. Due to the integrated Single Board Computer (SBC) with Windows 10 operating system, the software Lambda 2016 and the high resolution color touch display the devices are very user friendly.

Numerous interfaces such as RS232, USB and Gigabit Ethernet enable the connectivity to peripheral devices and the fast and convenient transfer of all relevant data. The connection to an external PC allows for performing extensive evaluations of the test results and printing of test reports.

Features:

  • Fully insulated (X) or temperature controlled (GX) test chamber to avoid external influences
  • Two device versions according to one (X1) or two plate (X2) method
  • 2 cooling options for different measuring ranges: internal Peltier or external recirculation cooler
  • Electrically operated plate lifting mechanism
  • Digital measurement of pressure and sample thickness
  • SBC with 32 GB SSD, Windows 10 and software Lambda 2016
  • 10.1“ color touch screen
  • Interfaces: 1x RS232, 2x USB, 1x Gigabit Ethernet

Technical data:

TLP 500 X1 (2) TLP 500 GX1 (2)
Measuring range* 0,005 – 1,0 W/m·K 0,005 – 1,0 W/m·K
Sample size (LxW) 250 x 250 –
500 x 500 mm
250 x 250 –
500 x 500 mm
Sample thickness (H) 10 – 120 mm
(2x 10 – 60 mm)
10 – 200 mm
(2x 10 – 100 mm)
Temperature range
Cooling plate
Heating plate
(min./max.)
-15 – +60 °C
-5 – +70 °C
(min./max.)
-15 – +60 °C
-5 – +70 °C
Dimensions (HxWxD) 179 x 80 x 90 mm 179 x 80 x 90 mm
Power supply 110 – 230 V 50/60 Hz 110 – 230 V 50/60 Hz
Weight 186 kg 192 kg

* depending on sample thickness